Postdoctoral researcher

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a
researcher with demonstrated knowledge of reliability testing and failure analysis for advanced
semiconductor packaging, with strength in polymeric materials and multilayer interfacial mechanics
relevant to CHIPS applications. The successful candidate will integrate reliability modeling with
experimental techniques to investigate how environmental stressors accelerate aging, property
degradation, and failure mechanisms in complex package architectures. The position requires expertise
in mechanical characterization of thin-film and multilayer interfaces, including adhesion and failure
onset, as well as a deep understanding of polymer structure-property relationships and failure analysis.

If selected, the researcher will play a significant role in NIST projects focused on reliability testing and
failure analysis for advanced packaging. Collaborating with NIST staff and external partners, the
researcher will design and execute experimental research to assess the impact of stress on the
mechanical and thermal properties of polymeric materials and interfaces used in advanced packages.
The research will aim to identify and quantify failure mechanisms, such as interfacial delamination,
cohesive cracking, and fatigue damage, and generate high-quality datasets for model calibration and
validation. These datasets will, in turn, inform the development of more accurate long-term reliability
prediction frameworks. Ultimately, the outcomes of this research will provide a scientific foundation for
the development of test methods, materials selection, and quality assurance protocols for the
semiconductor packaging industry, driving advancements in product reliability and performance.