Postdoctoral researcher
The candidate will join a multi-disciplinary team of scientists working to advance the current state-of-the-art in advanced metrologies to characterize, test, model, and validate the structure-processing-property relationships of polymeric materials and material interfaces for heterogeneous integration in semiconductor packaging. The candidate will plan and conduct research on the use of Raman and Brillouin microscopy to study the local mechanical properties of materials relevant to semiconductor packaging applications. This position will be a two-year appointment with the possibility of extending for an additional year.
Materials Research Engineer (CHIPS Project: Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage Measurements for Next-Generation Microelectronics Packaging under Device Relevant Conditions)
- PhD in physics, materials science, or other related field
- Background in Raman and Brillouin light scattering techniques required, including:
- Raman and Brillouin instrumentation and equipment
- The use of microscopy techniques for the measurement of viscoelastic properties of polymeric materials
- Broad knowledge of optics and instrument automation techniques preferred
- Strong oral and written communication skills
- Able to work productively as part of a team and independently
Key responsibilities will include but are not limited to:
- Plan and conduct research on advanced metrologies to characterize, test, model, and validate the structure-processing-property relationships of polymeric materials and material interfaces for heterogeneous integration in semiconductor packaging
- Use the Brillouin Light Scattering / Low-Frequency Raman microscope to measure local variations in the viscoelastic properties of semiconductor packaging materials
- Participate in the characterization of the mechanical properties of candidate Research Grade Test Materials
- Publish results in refereed scientific journals and present results at scientific conferences and meetings