Postdoctoral researcher
We are seeking a highly motivated researcher to advance measurement science for next-generation
hybrid advanced packaging. This role will contribute to the development of novel surface and materials
metrology methods that enable predictive control of bonding processes and heterogeneous integration.
The successful candidate will work within the Nanophotonics project to help establish the quantitative
foundations needed for reliable, high-density microelectronic assembly, supporting national efforts to
strengthen U.S. leadership in semiconductor manufacturing and advanced packaging technologies.
Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging(CHIPS Funded Project)
Necessary Qualifications:
- PhD in physics, electrical engineering, materials science, or a related field.
- Significant experience, including process development, in semiconductor device fabrication,
including wafer cleaning and handling, lithography mask layout, optical or electron beam
lithography, RIE, ICP RIE, PVD, CVD, ALD, wet etching, as well as characterization techniques such as
ellipsometry, profilometry, optical microscopy, SEM and AFM. - Proficiency in programming languages, such as Python, Java or Matlab.
- Excellent communication skills and ability to work effectively in a team.
Desirable Qualifications:
- Experience with flip-chip fusion and/or hybrid bonding processes
- Experience with XPS, UPS, FTIR, Raman, photoluminescence, other relevant modalities of
spectroscopy - Familiarity with silicon electronic, photonic or optoelectronic device processing
- Experience with custom infrared microscopy and optical measurement setups.
- Experience with III-V compound semiconductor process development and device fabrication.
- Experience with optoelectronic (e.g. semiconductor lasers, detectors, multi-functional photonic
integrated circuits, etc) device characterization. - Experience with photonic and optoelectronic device simulation software, such as Lumerical, Tidy3d,
or COMSOL. - US citizenship strongly preferred
The main responsibilities are:
- Fabricate Si, SiO2, SiN chips for flip-chip fusion and hybrid bonding experiments.
- Optimize and maintain fabrication processes, including chip handling and cleaning protocols.
- Perform surface and thin film characterization of chips used for flip-chip bonding experiments.
Characterization techniques include AFM, optical inspection, IR transmission microscopy,
spectroscopic ellipsometry, SEM and others. - Closely coordinate with teams performing materials characterization, bond strength testing and
modeling.