Modeling and Mechanical Testing for Heterogenous Structures of Advanced Semiconductor Packaging (CHIPS Funded Project)

Overview

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a
researcher with extensive expertise in finite element analysis and knowledge of one or more of the
following technical areas: instrumented mechanical testing, adhesion testing, polymer degradation
characterization, and material damage analysis and modeling.
If selected, you will play a significant role in the projects related to modeling and reliability testing of
advanced chip packaging and other electronics applications. This includes working with NIST staff and
external partners on setting up models to predict the behavior and investigate possible points of failure
during the service lifetime of heterogeneous multilayered polymeric, metal, and semiconductor
structures, identify crucial material parameters, and plan and execute experimental research to evaluate
changes of these material parameters after aging. The results will be used to understand the root causes
of the multilayer failures, providing a scientific basis for test method development, material selection,
and product quality assurance for the semiconductor industry.

Qualifications

• Currently live in the United States
• Ph.D. in Physics / Mechanical Engineering / Electrical Engineering / Materials Science / Chemical Engineering
• Experience in nano- and micro-scale mechanical testing and materials characterization
• Experience in finite element modeling of heterogeneous systems
• Experience in advanced semiconductor packaging is preferred
• Strong oral and written communication skills

Research Proposal

Key responsibilities will include but are not limited to:

• Developing finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterizing the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging.
• Developing reliability models for complex advanced packaging systems.
• Providing technical leadership on finite element modeling of failure mechanisms in multilayered polymeric structures.
• Disseminating research results through presentations at conferences, publication of journal papers, and technical reports.