Nanometer-Scale Planar Reference Materials (CHIPS Funded Project)

Overview

The Material Measurement Laboratory of the National Institute of Standards and Technology is
seeking qualified persons to join a team of researchers within the
NIST/CHIPS Nanometer-Scale Planar Reference Materials project working with advanced metrology
methods to characterize local physical and chemical properties and map any variation in these
properties of thin, nanometer-scale films deposited on Si (and SiC) wafers. The candidate will
measure and analyze these wafers using X-ray and optical methods to determine, through hybrid
metrology, structural maps for wafers with thin films of interest to the semiconductor community.

Work Location is Physically at NIST (Gaithersburg, MD).

Qualifications

• Ph. D in physics, materials science, or another related field
• Background in X-ray measurement technique(s) required, either: o X-ray reflectivity, X-ray fluorescence, or X-ray photoelectron spectroscopy
• Background in programming and/or data modeling using python recommended.
• Familiarity with thin film deposition and clean room access protocols, preferred
• Strong oral and written communication skills

Research Proposal

Key responsibilities will include but are not limited to:

• Plan and conduct research on advanced X-ray metrologies to determine structural (physical and chemical) properties of blanket (non-patterned) thin films on Si and SiC wafers
• Use lab-based and synchrotron X-ray characterization methods, to determine the structural properties of thin film samples
• Use open-source (python) fitting methods to constrain structural models, determine uncertainties, and combine these properties into a hybrid metrology digital wafer
• Perform wafer dicing, cleaning, and packaging of samples for distribution as Research Grade Test Materials
• Publish results in archival scientific journals and present results at topical meetings