Numerical modeling for nano-to-microscale thermo-mechanical measurements(CHIPS Funded Project)

Overview

The Materials Measurement Laboratory of the National Institute of Standards and Technology is seeking
qualified persons (U.S. Citizens Preferred) to perform finite element analysis and simulations related to
nanoscale and microscale material property measurements based on atomic force microscopy and
instrumented indentation. This work will focus primarily on numerical modeling of nanoscale and
microscale thermomechanical tests on materials and heterogeneous structures used in advanced
packaging of microelectronics.

Qualifications

• PhD in Materials Science or related field.
• Advanced knowledge and experience with finite element methods/multiscale modelling, particularly related to nano/microscale contact mechanics. Experience writing software and/or using python scripting to speed up/automate simulation workflows.
• Experience with computational materials research, particularly in the validation of experimental results or extraction of materials properties from complex experimental data.
• Knowledge of AFM and/or nanoindentation experiments. Hands on experience preferred.
• Knowledge of materials commonly used in BEOL layers and interconnects of microelectronic devices, particularly those used in hybrid bonding processes.
• Strong written and oral communication skills; ability to work independently and as part of a team.

Research Proposal

Key responsibilities will include but are not limited to:

• Perform finite element analyses to model the thermo-mechanical behavior of materials and structures at the micro- and nano-scale
• Research and develop theoretical models for the analysis of temperature-dependent micro/nanomechanical behavior of materials and heterogeneous structures at elevated temperatures. As needed, refine these models based on data from AFM and nanoindentation experiments.
• Publish results in peer reviewed scientific journals and present results at scientific conferences.